Special Session 6
Next-Generation Power Packaging and Thermal Management for WBG Devices
Important Dates
- Paper Submission Deadline: 6th Oct, 2025
- Paper Acceptance Notification: 14th Oct, 2025
- Camera-Ready Paper Submission Deadline: 31st Oct, 2025
- Final Registration Deadline: 31st Oct, 2025
Organizers
-
Dr. V. Vignesh Kumar
Assistant Professor
Department of Electrical and Electronics Engineering
National Institute of Technology Trichy
Email: vvigneshkumar@nitt.edu
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Dr. M.M. Rajan Singaravel
Assistant Professor
Department of Electrical and Electronics Engineering
NIT Puducherry
Email: rajan.singaravel@nitpy.ac.in
Technical Outline of the Session
Details for the technical outline will be provided soon.
Topics of Session
The original contributions, from different perspectives, including Ph.D Students , PG & UG Students, Academicians, researchers, and professional communities are invited under (but not limtied to) under the following topics:
- Advanced packaging topologies for SiC and GaN devices
- Parasitic inductance and EMI reduction in WBG power modules
- Compact and scalable thermal management techniques
- 3D integration, embedded packaging, and double-sided cooling
- Novel thermal interface materials and heat spreaders
- Reliability modeling, lifetime prediction, and accelerated testing
- High-temperature die-attach and interconnect technologies
- Industrial case studies of next-generation WBG power modules