Topics of Session:
The original contributions, from different perspectives, including Ph.D Students , PG & UG Students, Academicians, researchers,and professional communities are invited under (but not limtied to) under the following topics :
- Advanced packaging topologies for SiC and GaN devices
- Parasitic inductance and EMI reduction in WBG power modules
- Compact and scalable thermal management techniques
- 3D integration, embedded packaging, and double-sided cooling
- Novel thermal interface materials and heat spreaders
- Reliability modeling, lifetime prediction, and accelerated testing
- High-temperature die-attach and interconnect technologies
- Industrial case studies of next-generation WBG power modules